"Soft core/shell packages for stretchable electronics"

Chi Hwan Lee, Yinji Ma, Kyung‐In Jang, Anthony Banks, Taisong Pan, Xue Feng, Jae Soon Kim, Daeshik Kang, Milan S Raj, Bryan L McGrane, Briana Morey, Xianyan Wang, Roozbeh Ghaffari, Yonggang Huang, John A Rogers, Advanced Functional Materials, 25, 3698-3704